JouleForce™ Array

Air-Based Microchannel Heat Exchanger for High Power Electronics.

No Water. No Liquid Loops.

Uses ambient air inside patented microchannels to remove heat directly at the device. Enables higher rack density without pumps, CDUs, or liquid plumbing. Scales cooling by adding microchannels as needed.

  • Uses ambient air only to cool CPUs, GPUs, and ASICs

  • Low airflow requirement with highly efficient device-level heat removal

  • Reduces cooling power so more facility budget goes to IT load.

  • Eliminates liquid loop complexity and leak risk

  • Fits new builds and retrofit projects

  • Scales by adding microchannels as power density increases

    Custom array sizing and packaging available for your platform constraints

Applications

Sized and packaged to customer platform airflow paths and inlet temperature constraints. Engineered for high power density platforms across modern data center environments.

  • AI training and inference servers

  • High power CPU and GPU platforms

  • High density servers

  • HPC clusters

  • Networking equipment

  • ASIC platforms

  • Modular data centers

  • Edge data centers

  • Hot climate deployments

  • Water constrained regions

  • Liquid free retrofit projects

Contact us.

For more information on the JouleForce™ Array, pricing, designing, and applications please submit the contact form below