Microchannel Array

The building blocks to JouleForce™ Cooling: Low Cost, High Density, No Water

The Microchannel Array replaces traditional heatsinks with a smaller, lighter, and more efficient building block form factor. From a few watts to thousands, this scalable solution meets any cooling requirement of our customer’s electronics - add more Microchannel Array blocks to remove more heat.

Benefits

  • Smaller, lighter, and more efficient than traditional heatsinks - 32 watts/cm²

  • Lowers cooling energy requirements - mPuE 1.02 in Phoenix, Arizona

  • Can operate with conventional server fans or energy efficient blowers

  • Requires only ambient air without the use of air-conditioning or liquids - in any climate

  • Scalable to replace heatsinks on any electronics

  • Cools high power density board architecture - perfect for Artificial Intelligence Systems

  • Eliminates the need for liquid cooling - no water, no refrigerants

  • Seamlessly retrofits 1U to 5U server enclosures

Applications

  • Seamless datacenter retrofitting

  • High power density AI systems

  • Crypto currency mining

  • Power conversion electronics cooling

  • CPU and GPU cooling

  • Conduction cooled power supplies

  • Edge and Modular data centers

  • Electronic interconnect equipment

  • Lasers

  • Electric and combustion vehicles

  • Mobile electronics

  • Medical imaging equipment

Example Microchannel Array Configurations

MCA 1U 180 watt

Supported TDP: 180 Watts

Watts Cooled Per cm²: 31.57 Watts

Dimensions: 30.62mm x 29.93mm x 39.17

MCA 1U 300 watt

Supported TDP: 300 Watts

Watts Cooled Per cm²: 31.57 Watts

Dimensions: 50.1mm x 32.37mm x 39.34

MCA 2U 400 watt

Supported TDP: 400 Watts

Watts Cooled Per cm²: 48 Watts

Dimensions: 50.52mm x 37.7mm x 87.6mm

Size Matters

Our MCA 1U 180 watt Microchannel Array achieves the same amount of cooling with a significantly smaller package. This is a game-changer for server designs as the industry moves towards much more powerful processors that will need to operate in a smaller 1U configuration.

Conventional Heatsink

Server Form Factor: 2U

Supported CPU SKU: AMD EPYC™ 7000 and 7002 Series Processors

Supported CPU Socket: OLGA4094 (Socket SP3)

Supported CPU TDP: 180 Watts

Watts Cooled Per cm²: 1.9

Weight: 15.55 oz

Dimensions: 119.16mm x 78.89mm x 64.27mm

Microchannel Array 180W

Server Form: Factor: 1U

Supported CPU SKU: AMD EPYC™ 7000 and 7002 Series Processors

Supported CPU Socket: OLGA4094 (Socket SP3)

Supported CPU TDP: 180 Watts

Watts Cooled Per cm²: 32

Weight: 0.95 oz

Dimensions: 30.62mm x 29.93mm x 39.17

Contact us.

For more information on the Microchannel Array, pricing, and applications please submit the contact form below